A Korean company providing material solution for electrode packages is looking for R&D partner for developing copper sintered material for semiconductor package bonding. With the partner that has knowledge and expertise in reduction of copper surface oxide film, the Korean company is going to apply for EUREKA or EUROSTARS programme under research cooperation agreement.
Plazo para presentar expresiones de interés finaliza el 28 de febrero de 2022
La fecha límite de la convocatoria es el 30 de marzo de 2022